Polyetheramine Hot Melt Electronic Adhesive Glue Sealing Curing Agent D-230

Polyamide hot melt adhesive electronic sealing glue curing agent D-230 countertype C301

D-230 is characterized by repeating oxypropylene units in the backbone. It is a difunctional, primary amine with an average molecular weight of about 230.

1.The physical and chemical properties

2. Application

-Epoxy resin curing agent, adhesive (hard rubber) curing agent, curing agent for wind power blade

-Polyamide hot melt adhesive, electronic sealing glue curing agent

-electronic potting resin curing agent, curing agent for electronic packaging materials

-Fast curing RIM, building structure adhesive curing agent

-Polyether amine - modified curing agent, anticorrosive paint curing agent

-rod, golf clubs, tennis racket composite curing agent

3. Storage and packaging

Stored in a cool and dry place with ventilation and can be sealed for 12 months.

Avoid direct contact with water or strong acid and alkali.

Package:195kg/ iron drum.